Top experts review the latest patents they read and the latest papers
and lectures they attended at conferences; they then make a selection
of the most promising technologies and summarize in a few lines what
the substance you should take away with you.
Nov 20, 2011 - Liquid Bonding System for Providing Down-hole Cabling - Patent
Down-hole cables are found in use in many industries including those that conduct deep drilling, such as within the oil drilling industry. These...
Oct 30, 2010 - Sealing and fixturing a solar cell module. - Patent
In this invention, a solar cell base body is attached to a frame smoothly and without being damaged. At the time of attaching the solar cell base...
Jun 18, 2012 - Encapsulant Channels Cut Chip Scale Package Warpage - Patent
Cutting channels in encapsulant protecting semiconductor chips can prevent them from warping as the packaging structures that add further protection...
Apr 16, 2012 - X-Rays Give UV-Cured Adhesives A Light Inside - Patent
Adding phosphor materials that convert X-rays to light can help make UV-cured adhesives and encapsulants work better, US researchers have said this...
Mar 22, 2012 - Grooved Circuit Substrate Stops Encapsulant Overflow - Patent
Putting electronic chips together on a grooved surface can stop the encapsulant used to protect them interfering with high-speed manufacturing. That's...
Mar 12, 2012 - Penetrable Encapsulant Seals and Cools Chips - Patent
Using alumina-filled encapsulants to build electronic packages means electronic chips and their connections can be packed into them ever more closely....
Mar 08, 2012 - Encapsulant Control Enhances Print Quality - Patent
Researchers at Australian scientific service provider Silverbrook Research say that they have solved
printing problems caused by encapsulants used...
Feb 06, 2012 - Better Adhered Frontsheet Lights Up Solar Cells - Patent
Laminating ethylene copolymer blends to a surface-treated fluoropolymer film can provide integrated frontsheets for photovoltaic modules with improved...
Jan 23, 2012 - Twin Polymer Network Extends LED Encapsulants' Lifetime - Patent
Combining a more hydrocarbon-based resin with a conventional silicone resin can delay LED encapsulant deterioration, say researchers at Samsung...
Oct 27, 2011 - LED package holes avoid encapsulant delamination - Patent
Drilling holes into the outside of LED packages can help boost their reliability as they cycle from hot to cool and back again. That's according to a...
Oct 17, 2011 - Silicone Cube Encapsulant Advantages Get Clearer - Patent
Researchers in the US and Japan have discovered how to make infra-red and ultraviolet transparent, tough, polyhedral silsesquioxane encapsulants even...
Sep 05, 2011 - Two-phase Encapsulants Cut Semiconductor Warpage - Patent
Encapsulants that separate into one harder and one softer layer are offer improved cushioning of the stress that can build up around semiconductor...
Aug 20, 2011 - Embedding Security Elements into Credit Cards - Patent
The invention relates to a card, such as a credit card or ID card, which has several layers laminated with each other, wherein between a first card...
Jul 25, 2011 - All-silicone LED Package Cuts Stress - Patent
Thermal stress experienced by LED packages can be reduced by making their encapsulants and chip carrier boards from the same silicone material,...
Jul 11, 2011 - Light-catalysed Encapsulant Lowers Optical Device Costs - Patent
Taiwanese researchers say that they can make polymer encapsulants used to protect optical devices in as little as one-thirtieth of the time it would...
Jul 07, 2011 - EPDM Solar Encapsulants “save up to $8 per square metre” - Patent
Switching the material used to make encapsulants that protect photovoltaic cells could save $8 per square metre according to researchers from the US...
Jun 06, 2011 - Twin-layer Encapsulant Raises Solar Module Production Speed - Patent
Scientists at glass giant Saint-Gobain say that they can replace the separate encapsulants and frontsheets used to protect photovoltaic (PV) cells in...
Mar 28, 2011 - Triple Encapsulation Gets More Out of LEDs - Patent
White light-emitting-diodes have brighter prospects if they're made by covering a blue light-emitting chip with three encapsulant layers containing...
Mar 24, 2011 - Small Balls Provide Outstanding Data Density - Patent
Electronic packages constructed using small solder balls to protrude above protective encapsulants can provide more connections per unit area, Korean...
Mar 10, 2011 - Hybrid LED encapsulant ain't yellow - Patent
Combining the two main types of light emitting diode encapsulants, based on epoxy and silicone materials, provides robust but economical performance...
Feb 14, 2011 - EVA blend enhances solar encapsulant adhesion beyond glass - Patent
French chemical giant Arkema is positioning its ethylene/vinyl acetate (EVA) copolymers as encapsulants for photovoltaic cells that provide strong...
Feb 13, 2011 - Straw-based particle board bonded with composite adhesives. - Technical Paper
Environmentally friendly particleboard was prepared with wheat straw, an inexpensive material. The particleboards were produced by a mixing process,...
Jan 31, 2011 - Twin-Encapsulant Strategy Shrinks Multi-chip Packages - Patent
Semiconductor packaging firm STATS Chippac has developed a novel way to assemble chips in a smaller format by protecting a central cavity with two...
Jan 24, 2011 - Fluorescent epoxy shines for printhead failure analysis - Patent
Researchers at US printing giant Lexmark have developed an epoxy adhesive that can be distinguished from others because it fluoresces under...
Jan 23, 2011 - Semiconductor package with high heat transfer. - Patent
Modern semiconductor packages continue to become smaller due to improvements in fabrication technology. These smaller packages are more densely...
Oct 21, 2010 - Hot chips cut LED encapsulation cost - Patent
Light emitting diodes can be protected with encapsulant more cheaply and flexibly thanks to a method that heats the LED and the carrier board it's...
Oct 11, 2010 - Tannin-epoxy encapsulants enable electronic recycling - Patent
Epoxy encapsulants made from plant-derived tannin chemicals not only reduce reliance on fossil fuels for raw materials, but also allow the electronic...
Sep 30, 2010 - Intel's self-healing encapsulant protects hot chips - Patent
Encapsulants containing nanoparticle fillers offer stronger adhesion, and can arrest mechanical failures that would otherwise propagate and lead to...
Sep 15, 2010 - Bonding an electronic sensor into or onto a tire. - Patent
This invention describes an assembly for use in or on a tire. The assembly comprises an electronic device having a body and an adhesive coating on at...
Aug 30, 2010 - Encapsulant process cuts out carrier wafers - Patent
Covering semiconductor chips and the substrates that they're attached to with common encapsulants can avoid often-used extra reinforcement steps used...
Aug 23, 2010 - Flexible encapsulants hold print head durability promise - Patent
Researchers at US printer manufacturing giant Lexmark have developed their own flexible adhesives and encapsulants to try and reduce damage to the...
Aug 22, 2010 - UV curable sealant for liquid crystal display panels. - Technical Paper
A UV curable sealant was synthesized by polymerizing epoxy resin with acrylic acid in the presence of a catalyst (N, N-dimethylbenzylamine). The...
Jun 17, 2010 - Encapsulants enable tiny chip-circuit sandwiches - Patent
Electronic assembly firm STATS ChipPAC has eradicated much of the space taken up on printed circuit boards, by forming circuits directly on...
May 27, 2010 - Blade encapsulant shaper shrinks printheads - Patent
Applying encapsulant to protect wires attached to inkjet printheads with a profiling blade ensures a more consistent amount of material is used than...
May 24, 2010 - Trenches battle LED adhesive overflow - Patent
The problems caused by low-viscosity insulating adhesives used in LED packages flowing onto inappropriate circuitboard areas can be overcome by an...
May 20, 2010 - Infra-red absorber encapsulant allows night vision flying - Patent
Adding dye directly to encapsulants of LEDs provides a cheaper and more robust way to allow them to illuminate flight decks where crews use night...
May 17, 2010 - Hybrid encapsulant improves optical performance - Patent
The two main chemical classes used to protect optoelectronic chips like LEDs can be combined to make an even more robust material, Asahi Kasei...
May 06, 2010 - Low viscosity polyurethane eases dialysis filter potting - Patent
Filters for dialysis can be produced with higher content of the fibres that allow fluid through, thanks to German chemical giant BASF's latest...
Apr 15, 2010 - Electronic encapsulant avoids pre-assembly baking - Patent
GE researchers have developed an encapsulant that eliminates the need for preventative steps normally taken to ensure that they do not damage the...
Apr 01, 2010 - Asymmetric encapsulant beads promise cleaner printing - Patent
Australian researchers have developed a way to shape encapsulant droplets used to protect printhead electronics, reducing their detrimental affect on...
Mar 22, 2010 - Olefin encapsulant promises hardier solar panels - Patent
A US scientist hopes to replace EVA sheets used to assemble photovoltaic cells or modules with an encapsulant that promises better adhesion and longer...
Mar 19, 2010 - Epoxy resin for sealing electronic apparatus. - Patent
The invention provides a liquid resins composition for electronic part sealing. The resin exhibits good fluidity and a narrow gap. It is free from...
Mar 15, 2010 - Adhesive sheets speed camera phone manufacture - Patent
Layers of solid silicone encapsulant can provide more effective protection for LCD driver circuits near to camera flashes, and accelerate production...
Mar 05, 2010 - Moisture effects on adhesion of electronic attachments. - Technical Paper
Moisture is a principal cause of failure in adhesive attachments in the electronic industry. The purpose of this paper is to examine the long term...
Feb 25, 2010 - Modified encapsulation improves chip packaging process - Patent
Taiwanese researchers are using encapsulants' adhesion to make packages that extract more heat from chips while lowering the risk of breaking them in...
Jan 29, 2010 - Silicone adhesive exhibiting transparency and hardness. - Patent
This invention describes a curable silicone adhesive composition that can be cured at room temperature. It exhibits favorable adhesiveness, and...
Jan 23, 2010 - Sealing of components for use in solar cells. - Patent
Thermoplastic resin composition for sealing of solar cell components was derived from propylene based polymers and other components. The...
Jan 11, 2010 - Adapted encapsulation process cuts chip costs - Patent
Scanning and storing individual chips' contact alignment before coating them with encapsulant allows cheaper manufacturing than coating them when they...
Jan 07, 2010 - Encapsulant patterning helps boost LED light output - Patent
Printing and moulding patterns into encapsulants used to protect light emitting diodes can enhance the total amount of light that they produce. That's...
Dec 26, 2009 - Flame resistant, flexible epoxy adhesive. - Patent
This invention relates to an epoxy resin composition having an epoxy resin and a phenolic hydroxyl group containing polyamide. Cured products of the...
Dec 22, 2009 - Epoxy adhesive method boosts LED quality control - Patent
Adapting the way in which epoxy insulating adhesive is introduced to an LED package can reduce the number of sub-standard devices getting to market,...
Nov 30, 2009 - Foaming adhesive speeds solar cell encapsulation - Patent
German researchers have slashed the time taken to encapsulate solar cells from 20 minutes to just one minute, by adding “microballoons” to their...
Oct 22, 2009 - Encapsulation lowers image sensor manufacturing cost - Patent
A compact silicon-based image sensor protected mainly by a simple adhesive dispensing step can be produced more cheaply than existing rival methods...
Sep 14, 2009 - Encapsulant adhesive speeds image sensor assembly - Patent
Taiwanese engineers have slashed the process time taken to produce camera-style image sensors. Impac Technology has applied for a US patent for a...
Sep 04, 2009 - Penetrable film adhesive simplifies chip packaging - Patent
Singaporean firm Stats Chippac has patented a technique for getting semiconductor chips and the wires that bond them closer together than ever before....
Aug 06, 2009 - Protected phenolic extends electronic adhesive lifetimes - Patent
US startup Trillion Science is tackling one-part phenolic-epoxy and phenolic-benzoxazine materials' limited shelf-life by using what it calls...
Aug 03, 2009 - Dai-Nippon shrinks encapsulated semiconductor chips - Patent
Japanese scientists have reduced the total horizontal area taken up by a semiconductor chip and its electrical terminals in an encapsulated package. A...
Aug 01, 2009 - Multifunctional sealant includes desiccant. - Patent
A thin film photovoltaic panel and a method for making it are described in this patent. A photovoltaic substrate having at least one edge has an...
Jul 27, 2009 - Encapsulants protect stacked semiconductor packages - Patent
Electronics manufacturers can now save valuable space on their printed circuit boards, thanks to a patent application for a method of combining...
Jul 15, 2009 - Encapsulation preserves ultra-thin organic transistors - Patent
Protecting a poly(3-hexylthiophene) semiconducting film just two to three atoms thick with glass and a UV-cured acrylate adhesive can dramatically...
Jun 15, 2009 - UV-cured encapsulants boost OLED lifetimes - Technical Paper
Scientists in Taiwan have developed an encapsulant adhesive that they say helps reduce many of the corrosion problems currently limiting the...
Jun 07, 2009 - Building filters in-situ. - Patent
Oil is often filtered through gravel packs to remove particulates during a pumping operation. Some 40% of the world’s reservoirs require filtration. ...
