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Adhesives used in applications in which manufactured goods are packaged, are often required to adhere to a wide range of inks, coatings, and overprint lacquers. The substrates themselves can also vary in physical characteristics, such as rigidity, density, and chemical make-up. As a result, adhesives must be formulated to overcome these obstacles. Consequently, adhesive formulators are continuously evaluating new materials and novel formulation strategies in order to develop an adhesive with the broadest possible application window. The present invention relates to hot melt adhesives, and more specifically to a hot melt adhesive formulation utilizing a blend of polymers which includes a polyolefin polymer and an olefinic block copolymer (OBC). The hot melt formulations in this invention demonstrated improved hot tack, adhesion, and bond line flexibility over other traditional hot melt adhesives.