Patent - This invention describes methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.

Source : Watson, M.N., et . al., “Methods and Apparatus for Void-Free Debulking of Adhesive Bonded Joints”, US Patent Applications 2012/0125534, May 24, 2012.

Rate & React!

To react about this document, please identify first.

User ID		Forget ID/Password?
Password

Not a member yet? Take 2min to register for free and add your reaction right after.