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This invention relates to an adhesive compound consisting essentially of an organic phase and inorganic phase, the organic phase comprising an amorphous aliphatic (co)polymer having a Ring & Ball softening point of between 75° and 180°C, and a second aliphatic material having a Tg of about −5° C or lower and a kinematic viscosity of 4500 mm2/s at 100°C or less, wherein said organic components are...