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Ultrasonic Anisotropic Bonding Squashes Resistance

Andrew Extance - May 21, 2012

Patent - Korean researchers have developed a method for forming reliable directional connections using ultrasonic waves to cure insulating adhesives and melt solder. Anisotropically conductive adhesives (ACAs), which are usually insulating adhesives containing conductive particles, are already commonly used as an alternative to solder for electronic connections. They can create tightly-spaced matrices of...

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Source : Paik, K.-W.; Lee, K.; Kim, S. H. “Anisotropic Conductive Adhesive For Ultrasonic Wave Adhesion, and Electronic Parts Connection Method Using Same”, US Patent Application No. 20120118480, May 17, 2012

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