R&D HighlightsTop experts review the latest patents they read and the latest papers and lectures they attended at conferences; they then make a selection of the most promising technologies and summarize in a few lines what the substance you should take away with you. Positioning Connection Balls Deeper In Encapsulant Improves Electronic Packaging
Andrew Extance
- Mar 26, 2012
Patent -
Sticking semiconductor chips to thin materials with holes in can make electronics cheaper, smaller and more reliable, according to Noriyuki Kimura from Chiba, Japan, precision manufacturer Seiko Instruments. Modern ball grid array (BGA) electronic packages mount semiconductor chips onto complex double-sided multilayer substrates using an insulating adhesive. Manufacturers cover the chip in...
Source : Kimura, N. “Ball grid array semiconductor package and method of manufacturing the same”, US Patent Application No. 20120068340, March 22, 2012
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