Top experts review the latest patents they read and the latest papers
and lectures they attended at conferences; they then make a selection
of the most promising technologies and summarize in a few lines what
the substance you should take away with you.
Sticking semiconductor chips to thin materials with holes in can make electronics cheaper, smaller and more reliable, according to Noriyuki Kimura from Chiba, Japan, precision manufacturer Seiko Instruments. Modern ball grid array (BGA) electronic packages mount semiconductor chips onto complex double-sided multilayer substrates using an insulating adhesive. Manufacturers cover the chip in...