Patent - Shaping the encapsulant material used to protect LED chips can help more of the light it produces escape and provide useful illumination. One of the major challenges still facing LED producers is minimising total internal reflection that keeps light in the chip and package. Transparent encapsulant materials protect the LED electronics, but they also have another role. They are usually chosen to...

Source : Hsu, C.-C.; Su, W.-L. “Light-Emitting Diode Package”, US Patent Application No. 20110233594, September 29, 2011

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