R&D HighlightsTop experts review the latest patents they read and the latest papers and lectures they attended at conferences; they then make a selection of the most promising technologies and summarize in a few lines what the substance you should take away with you. Adhesive composition with bond enhancing agent for producing wood board.
Edward M. Petrie
- Jan 23, 2011
Patent -
Improved adhesives with significantly enhanced bond strength are provided in this invention. The adhesives are made by adding a bond strength enhancing agent composed of particles to a binder. Such adhesives can be used in a process of producing wood boards, which results in a substantial reduction in the amount of adhesive used. This leads to a reduction in overall board production costs. ...
Source : Korai, H., “Adhesive Compositions Containing Bond-Strength Enhancing Agent and Methods for Producing Woody Board Using Adhesive Compositions”, US Patent Application 2010/0326583, December 30, 2010.
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