R&D HighlightsTop experts review the latest patents they read and the latest papers and lectures they attended at conferences; they then make a selection of the most promising technologies and summarize in a few lines what the substance you should take away with you. Layered adhesive tackles LCD short problem
Andrew Extance
- Nov 8, 2010
Patent -
Layering a thick, strong, insulating adhesive on top of a thinner anisotropically conductive film (ACF) can help resolve short-circuits occurring in LCD manufacturing, say researchers at Hitachi Chemical. Chip-on-flex semiconductor chip carriers and finer pitch spacing between electrodes in LCD modules, used to miniaturise these products, is causing shorting between adjacent electrodes to become a...
Source : Tatsuzawa, T.; Kobayashi, K.; Ito, A. “Circuit Connecting Material and Structure for Connecting Circuit Member”, US Patent Application No. 20100277885, November 4, 2010
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