R&D HighlightsTop experts review the latest patents they read and the latest papers and lectures they attended at conferences; they then make a selection of the most promising technologies and summarize in a few lines what the substance you should take away with you. Hot chips cut LED encapsulation cost
Andrew Extance
- Oct 21, 2010
Patent -
Light emitting diodes can be protected with encapsulant more cheaply and flexibly thanks to a method that heats the LED and the carrier board it's mounted on. The two main existing encapsulation methods are compression moulding and transfer moulding, which require molds and expensive injection machines. In addition, their moulding cavities can be deformed or damaged in use, reducing manufacturing...
Source : Chang, W. S.; Kuo, C. T. “Packaging Process Of Light Emitting Diode”, US Patent Application No. 20100261299, October 14, 2010
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