R&D HighlightsTop experts review the latest patents they read and the latest papers and lectures they attended at conferences; they then make a selection of the most promising technologies and summarize in a few lines what the substance you should take away with you. Epoxy composition with a high degree of cure and strength at relatively low cure temperatures.
Edward M. Petrie
- Sep 29, 2010
Patent -
Polymer compositions capable of a high degree of curing at relatively low temperatures are described in this invention. These compositions can be used as prepregs, adhesives, films, and composites. The polymer compositions include epoxy resin systems and a dual curing system. The curing system includes one or more curing agents containing one or more hydrazine-based curing agents and one or...
Source : Bongiovanni, C.L., and Boyd, J.D., “Epoxy Composition with Improved Mechanical Performance”, US Patent Application 2010/0222461, September 2, 2010.
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