The invention relates to novel aqueous, crosslinkable polyurethane dispersions based on terephthalic acid polyesters, the production thereof and their use in combination with hydroxy-functional reactants for the production of lacquers, coatings and s...
Silicone acrylic hybrid compositions prepared by reacting together silicone polymers, silicone resins, and silyl containing acrylic polymers are useful in adhesive compositions that find use in skin contact applications.
The present invention describes polymer comprising one or more C3 to C40 olefins and having a Mw of 100,000 or less and a Dot T-Peel of 1 Newton or more. The polymer may have a branching index (g′) of 0.95 or less measured at the Mz of the polymer, a...
Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydri...
Compositions, thermoset compositions, and methods of forming the same, including an epoxy resin, a curing agent, and a silicone-acrylate core/shell rubber are disclosed.
Disclosed is an aqueous adhesive agent composition which has no concern about environmental safety and can be used as an adhesive agent composition for automobile interior materials. The aqueous adhesive agent composition comprises (A) an acid-modifi...
A method of dissolving an oxidized polysaccharide in an aqueous solution using an oligomer additive is described. The resulting aqueous solution of the oxidized polysaccharide may be used in combination with an aqueous solution comprising an amine-co...
A method of making a semiconductor chip assembly includes providing a bump and a ledge, mounting a first adhesive on the ledge including inserting the bump into an opening in the first adhesive, mounting a conductive layer on the first adhesive inclu...
A method of bonding semiconductor dice onto a substrate first uses an optical assembly to perform pattern recognition of a die bonding section of the substrate in which multiple die pads are located so as to identify positions of the multiple die pad...
A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2)...
A method of indirect bonding and a physical model that allows for optimal positional alignment of orthodontic appliances on a patient's teeth is disclosed. The physical model of the patient's teeth has pods and ridges on the facial surface of the tee...
A photocurable pressure-sensitive adhesive composition, a photocurable pressure-sensitive adhesive layer, and a photocurable pressure-sensitive adhesive sheet including a support and such a photocurable pressure-sensitive adhesive layer formed on at ...
To provide an infrared-light reflective plate having improved selective reflectivity characteristics, there is provided an infrared-light reflective plate reflects an infrared-light of equal to or longer than 700 nm including a substrate, and, on at ...
A vehicle is wrapped by a printed adhesive film where the film is also applied over doors and other areas intended not to be covered. The film is cut at the door edge and over the area by adhesively attaching a tape having a release coating on the fr...
To obtain large adhesive strength by forming openings with a sufficient size and high precision in a non-adhesive layer of an adhesive label, and exposing an adhesive agent layer through the openings, heat or a physical force is applied to a non-adhe...
Provided is a pressure-sensitive adhesive sheet for optical use which less suffers from a misoperation-causing change in capacitance upon application to an optical member.
The method for surface inclusions detection, enhancement of endothelial and osteoblast cells adhesion and proliferation and sterilization of electropolished and magnetoelectropolished Nitinol implantable medical device surfaces uses an aqueous soluti...
A manufacturing method for a composite alloy bonding wire and products thereof. A primary material of Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with t...
A turbine bucket includes an airfoil portion and a tip shroud at a radially outer end of the airfoil portion. The tip shroud includes a first radially inner tip shroud component formed integrally with the airfoil portion and composed of a first metal...
A bonding structure that provides excellent conductivity and bonding between a piezoelectric body and a metal plate includes a metal plate and an electrode of a piezoelectric body bonded to one another with an electrically conductive adhesive so as t...
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and dual adhesives. The heat spreader includes a bump, a base and a ledge. The conductive trace includes a pad and a terminal. The semiconductor device...
The present disclosure provides a tape comprising: a) a single layer comprising a crosslinked polymer, selected from the group consisting of crosslinked polyurethane, crosslinked polyurea, and crosslinked mixed polyurethane/polyurea polymer, and b) a...
A bonding apparatus includes a thermal treating unit and a bonding unit that are integrally bonded together. The thermal treating unit includes a first thermal treating plate for supporting and thermally processing a superimposed substrate. The bondi...
An article of manufacture includes a label, a first glue resist area. The first glue resist area is located on a back of the label. The first glue resist area is configured to prevent at least one edge of the label from curling during a labeling proc...
A self-adhesive notepaper holder, which comprising: a paging plate, at one side of which a threading portion and a locating portion are arranged; several notches are arranged at the other side of said paging plate correspondingly to the threading por...
