News - Flex Pack - Channels - Omnexus 4 Adhesives

Receive our Adhesives & Sealants Innovation and Solutions Bulletin

Jan 27, 2012 - GERNEP to Showcase Latest Developments of Rotary Labelling Systems at Anuga FoodTec 2012
GERNEP - the Bavarian manufacturer of labelling machines - presents at "Anuga FoodTec 2012" latest developments of the different rotary labelling systems for the food industry. GERNEP is well prepared for modern self adhesive labelling. The rotary...
Jan 16, 2012 - Bosch to Present Single-wrap Die-fold Package with Hermetic Seals at ProSweets 2012
Bosch Packaging Technology will present its first single-wrap die-fold package with hermetic seals at ProSweets 2012 in Cologne. The hermetically sealed single-wrap die-fold package with only one film allows for maximum product safety. The pack...
Jan 16, 2012 - Stora Enso Develops LumiLiner Featuring Adhesion-friendly Reverse Side for Corrugated Industry
Stora Enso has developed a new liner in close collaboration with producers of boxes and corrugated packaging. With a basis weight of 90 g/m2, this new liner combines the softness of lightweight paper with the bulk and tear resistance of significantly...
Jan 5, 2012 - Ellsworth Launches QuikDot Pro Applicator for Box/Case Sealing
Ellsworth Adhesives has teamed with Glue Dots International® (GDI) on the commercialization of a revolutionary new packaging technology, the QuikDot Pro applicator. The QuikDot Pro is a pressure sensitive adhesive applicator designed to...
Jan 3, 2012 - Toray Introduces Torayfan® KMS1 Heat-Sealable Matte BOPP Film for Packaging
Toray Plastics (America), Inc. introduces to CPG's and converters new Torayfan® KMS1 70-gauge biaxially-oriented heat-sealable matte polypropylene film designed to be used as an outer web in food packaging applications requiring a premium...
Dec 19, 2011 - Avery Dennison Launched Curve Appeal™ System and Fasson Curvy™ Film at Labelexpo Asia
Avery Dennison, for the very first time in Asia Pacific, introduced Curve Appeal™ system and Fasson Curvy™ film to visitors at the Labelexpo Asia. This unique machine and label combination creates a wraparound look with the shelf appeal of...
Dec 13, 2011 - Dow Corning Presents 2nd Generation Syl-off® Advantage Series Products at Labelexpo Asia 2011
Dow Corning showcases it's more than 60 year's silicone expertise in pressure sensitive market in Labelexpo Asia 2011. During the fourth day event, Dow Corning presents its second generation Syl-off® Advantage Series products. The new...
Dec 13, 2011 - UPM Raflatac Introduces RH09 Hotmelt Adhesive for Food Package Labeling
UPM Raflatac announces the release of its new and improved RH09 hotmelt adhesive for the Americas market, which is designed to meet the rigors of food package labeling. Labelstock converters and end-users leverage RH09 products for industry...
Dec 7, 2011 - Robatech Offers Customized Packaging Solutions at Cologne 2012
Robatech offers customized packaging solutions for the sugar confectionery industry. Small folding boxes are normally used for sweets and chewing gum, and cardboard sheaths and wrappers for bars of chocolate. They feature particularly small glued...
Nov 29, 2011 - BASF to Showcase Water-based and UV Technologies for Packaging Industry at LabelExpo Asia 2011
BASF will present its high performance water-based and UV technologies for the adhesives, printing and packaging industries at the LabelExpo Asia 2011 in Shanghai from November 29 to December 2, 2011. BASF is the leading photoinitiator supplier in...
Nov 25, 2011 - RR Donnelley Acquires StratusGroup and Expands Packaging and Product Labeling Platform
R. R. Donnelley & Sons Company has announced that it has acquired West Chester, OH based StratusGroup, Inc., a full service manufacturer of custom pressure sensitive label and paperboard packaging products for health and beauty, food, beverage and...
Nov 23, 2011 - Innovia Films and Sappi Join Hands towards Innovative Sustainable Packaging Solutions
Innovia Films and Sappi Fine Paper Europe have joined forces to demonstrate potential laminate structures, using their respective products, suitable for end users in the food, confectionery and pharmaceutical industries. These laminates provide...
Nov 17, 2011 - Schreiner Develops Die-cut Metal Foils for Direct Bonding of LEDs
Schreiner ProTech uses delicately die-cut metal foils in an innovative approach to support the miniaturization trend in the electronics industry. The extremely thin foils perform complex electronic functions. This new production technique makes it...
Nov 16, 2011 - Three More Fasson® Label Constructions Meet Recycling Protocol Requirement
Avery Dennison Label and Packaging Materials has announced that three additional Fasson® label constructions have met the protocol requirements of the Association of Post-consumer Plastic Recyclers (APR) for the recycling of PET thermoformed...
Nov 15, 2011 - Nordson Showcases Precision Hotmelt Glue Bonding for Mobile Devices at Productronica
Nordson ASYMTEK is hosting live demonstrations of precision coating and jetting processes at Productronica. Precision hot melt glue bonding for mobile devices, automotive displays, and component or vibration pad holding are being demonstrated on the...
Nov 11, 2011 - ACTEGA Gets ALTANA Innovation Award for PVC-free Sealing Compound System in Food Packaging
ACTEGA has been awarded with the annual ALTANA Innovation Award. The award went to PVC-free sealing compound system, which are already successfully distributed under the brand name PROVALIN in the food packaging market. This innovation responds to...
Nov 10, 2011 - Avery Dennison Honored with Environmental Leadership Award by TLMI
Avery Dennison Label and Packaging Materials Business Unit announced has received the 2011 Environmental Leadership Award from the Tag and Label Manufacturers Institute (TLMI). The award, given by the TLMI Environmental Committee, recognizes the...
Nov 4, 2011 - Avery Dennison Shrink PS Enables Late-stage Decorating of Vacuum-shrink Bags
Avery Dennison Shrink PS labels are applied to shrinkable bags off-line or in-line prior to filling and vacuum sealing. Compared with preprinted shrink-bag labeling, the Shrink PS solution offers enhanced labeling flexibility and the opportunity to...
Oct 27, 2011 - Schreiner ProTech to Showcase Self-adhesive Labels for Electronics Industry at Productronica 2011
Schreiner ProTech will showcase its portfolio for the electronics industry at productronica 2011 in Munich from November 15 to 18. It includes self-adhesive labels for application to extremely small areas, miniature venting elements, RFID...
Oct 25, 2011 - Weilburger Introduces SENOBOND® WB Film Laminating Adhesive for Food Packaging
Weilburger Graphics GmbH launches a radical innovation in the field of film laminating adhesives, its new SENOBOND® WB FILM LAMINATING ADHESIVE FP NDC 29-3536 375222 onto the market. The film laminating adhesive was especially developed for the...